Microsemi W3E32M72SR-266BM

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

208

Manufacturer Part Number

W3E32M72SR-266BM

Part Life Cycle Code

Transferred

Ihs Manufacturer

MICROSEMI CORP

Package Description

BGA,

Risk Rank

5.58

Access Time-Max

0.75 ns

Number of Words

33554432 words

Number of Words Code

32000000

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY

Supply Voltage-Nom (Vsup)

2.5 V

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

1 mm

Reach Compliance Code

unknown

JESD-30 Code

R-PBGA-B208

Supply Voltage-Max (Vsup)

2.7 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

MILITARY

Supply Voltage-Min (Vsup)

2.3 V

Number of Ports

A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

1

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

SYNCHRONOUS

Organization

32MX72

Seated Height-Max

2.77 mm

Memory Width

72

Memory Density

2415919104 bit

Memory IC Type

DDR DRAM

Access Mode

Distinct operation recognized by the protection mechanisms as a possible operation on an object.

FOUR BANK PAGE BURST

Self Refresh

YES

Length

25.1 mm

Width

16.1 mm