VSC8530XMW-04

Microsemi VSC8530XMW-04

Part No:

VSC8530XMW-04

Manufacturer:

Microsemi

Datasheet:

-

Package:

48-VFQFN Exposed Pad

AINNX NO:

48317326-VSC8530XMW-04

Description:

1P, CU FE PHY, RGMII/RMII, ITEMP

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    48-VFQFN Exposed Pad
  • Supplier Device Package
    48-QFN (6x6)
  • Series
    *
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
0 Similar Products Remaining