Microsemi SG1644Y

ECCN (US)

EAR99

Driver Type

High and Low Side

Driver Configuration

Non-Inverting

Bridge Type

Full Bridge

High and Low Sides Dependency

Synchronous

Maximum Rise Time (ns)

40

Maximum Fall Time (ns)

40

Maximum Operating Frequency (kHz)

1500

Maximum Propagation Delay Time (ns)

35

Input Logic Compatibility

TTL

Minimum Operating Supply Voltage (V)

4.5

Maximum Operating Supply Voltage (V)

20

Maximum Supply Current (mA)

35

Typical Input Low Threshold Voltage (V)

0.7(Max)

Typical Input High Threshold Voltage (V)

2(Min)

Peak Output Current(A)

3

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Supplier Temperature Grade

Military

Standard Package Name

DIP

Supplier Package

CDIP

Mounting

Through Hole

PCB changed

8

Lead Shape

Through Hole

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

8

Number of Outputs

2

Number of Drivers

2

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS non-compliant