Micron Technology PIC16LF88-I/P

Mount

Through Hole

Number of Pins

18

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

Ferrite

RoHS

Non-Compliant

Number of I/Os

16

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

10 %

Termination

Axial

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

105 °C

Min Operating Temperature

-55 °C

Shielding

Unshielded

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

130 mA

Inductance

33 µH

Test Frequency

a statistical procedure for assessing data that contain counts or the numbers of occurrences of various categories or classes.

2.5 MHz

DC Resistance (DCR)

3.4 Ω

RAM Size

368 B

Max DC Current

130 mA

Number of Bits

8

Q Factor

45

Core Architecture

PIC

Self Resonant Frequency

The self resonant frequency of an inductor is the frequency at which the parasitic capacitance of the inductor resonates with the ideal inductance of the inductor resulting in an extremely high impedance. At this frequency the device looks like an open circuit.

24 MHz

Length

6.35 mm

Lead Free

Contains Lead