MTFDHBA1T0TDV-1AZ15ABYY

Micron Technology MTFDHBA1T0TDV-1AZ15ABYY

Part No:

MTFDHBA1T0TDV-1AZ15ABYY

Manufacturer:

Micron Technology

Datasheet:

-

Package:

4-SOJ, 5.50mm pitch

AINNX NO:

39500357-MTFDHBA1T0TDV-1AZ15ABYY

Description:

SSD 1TB M.2 MODULE TLC NVME

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    4-SOJ, 5.50mm pitch
  • Weight
    -
  • Package
    Tape & Reel (TR)
  • Base Product Number
    MC-306
  • Mfr
    EPSON
  • Product Status
    Active
  • Memory Types
    Solid State Drive (SSD) FLASH - NAND (TLC)
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C
  • Series
    MC-306
  • Size / Dimension
    0.315 L x 0.126 W (8.00mm x 3.20mm)
  • Type
    kHz Crystal (Tuning Fork)
  • Voltage - Supply
    -
  • Frequency
    32.768 kHz
  • Frequency Stability

    the variation of output frequency of a crystal oscillator due to external conditions like temperature variation, voltage variation, output load variation, and frequency aging.

    -
  • ESR (Equivalent Series Resistance)
    50 kOhms
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    1TB
  • Load Capacitance

    the amount of capacitance measured or computed across the crystal terminals on the PCB. Frequency Tolerance. Frequency tolerance refers to the allowable deviation from nominal, in parts per million (PPM), at a specific temperature, usually +25°C.

    -
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    Fundamental
  • Frequency Tolerance

    the maximum allowable deviation from the nominal crystal frequency at a specified temperature, usually 25℃. The recommended frequency tolerance of the crystal over the manufacturing process is ±50 ppm.

    -
  • Current - Max
    -
  • Form Factor

    an aspect of design which defines and prescribes the size, shape, and other physical specifications of hardware components, particularly in electronics and electronic packaging

    M.2 Module
  • Speed - Read
    3.3GB/s
  • Speed - Write
    2.7GB/s
  • Height Seated (Max)
    0.100 (2.54mm)
  • Ratings
    -
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