Micron NAND08GR3B4CZL6F

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

52

Manufacturer Part Number

NAND08GR3B4CZL6F

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICRON TECHNOLOGY INC

Package Description

LGA, LGA52(UNSPEC)

Risk Rank

5.84

Access Time-Max

30 ns

Number of Words

1073741824 words

Number of Words Code

1000000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LGA

Package Equivalence Code

LGA52(UNSPEC)

Package Style

GRID ARRAY

Supply Voltage-Nom (Vsup)

1.8 V

Type

SLC NAND TYPE

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BUTT

Reach Compliance Code

unknown

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

1.8 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Supply Current-Max

0.02 mA

Organization

1GX8

Memory Width

8

Standby Current-Max

0.00005 A

Memory Density

8589934592 bit

Parallel/Serial

PARALLEL

Memory IC Type

FLASH

Data Polling

NO

Toggle Bit

NO

Command User Interface

YES

Number of Sectors/Size

8K

Sector Size

128K

Page Size

2K words

Ready/Busy

YES