MT35XL02GCBA1G12-0SIT

Micron MT35XL02GCBA1G12-0SIT

Part No:

MT35XL02GCBA1G12-0SIT

Manufacturer:

Micron

Datasheet:

-

Package:

-

AINNX NO:

32621199-MT35XL02GCBA1G12-0SIT

Description:

Flash Memory, 2Gbit, -40 To 85Deg C; Flash Memory Type:serial Nor; Memory Size:2Gbit; Flash Memory Configuration:256M X 8Bit; Ic Interface Type:spi

Products specifications
  • Factory Lead Time
    8 Weeks
  • Lifecycle Status
    Production (Last Updated: 2 years ago)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    24
  • Manufacturer Part Number
    MT35XL02GCBA1G12-0SIT
  • Rohs Code
    Yes
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    MICRON TECHNOLOGY INC
  • Package Description
    TBGA,
  • Risk Rank
    5.5
  • Clock Frequency-Max (fCLK)
    133 MHz
  • Number of Words
    2147483648 words
  • Number of Words Code
    2000000000
  • Operating Temperature-Max
    85 °C
  • Operating Temperature-Min
    -40 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    TBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE
  • Supply Voltage-Nom (Vsup)
    3 V
  • Reflow Temperature-Max (s)
    30
  • Schedule B
    8542320070
  • Factory Pack QuantityFactory Pack Quantity
    1122
  • Brand
    Micron
  • Tradename
    Xccela
  • RoHS
    Details
  • Series
    MT35X
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • JESD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Subcategory
    Memory & Data Storage
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    1 mm
  • Reach Compliance Code
    compliant
  • JESD-30 Code
    R-PBGA-B24
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    3.6 V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    2.7 V
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Organization
    2GX1
  • Seated Height-Max
    1.2 mm
  • Memory Width
    1
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    NOR Flash
  • Density
    2 Gb
  • Memory Density
    2147483648 bit
  • Parallel/Serial
    SERIAL
  • Memory IC Type
    FLASH
  • Programming Voltage

    A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

    3 V
  • Product Category

    a particular group of related products.

    NOR Flash
  • Length
    8 mm
  • Width
    6 mm
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