RAS-HS-C

Micro Connectors, Inc. RAS-HS-C

Part No:

RAS-HS-C

Datasheet:

RAS-HS-C.pdf

Package:

-

AINNX NO:

69695790-RAS-HS-C

Description:

HEATSINK RASPBERRY PI ALUM/COP

Products specifications
  • Material
    Aluminum, Copper
  • Shape
    Rectangular, Fins; Square, Fins
  • Package Cooled
    Raspberry Pi 2B, 3B, 3B+, 4B, B+
  • Mfr
    Micro Connectors, Inc.
  • Base Product Number
    RAS-HS
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Retail Package
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    Top Mount Kit
  • Attachment Method
    Thermal Tape, Adhesive (Included)
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