Micro Connectors, Inc. NGFFM2-HS803-BK

Base Product Number

NGFFM2-H

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Retail Package

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Accessory Type

Heat Sink Kit

Specifications

a measure of a material's ability to?conduct heat.?

Black, Heat Sinks, QIG, Rings, Thermal Pad