Mounting Type
Surface Mount
Package / Case
SC-70, SOT-323
Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES
Supplier Device Package
SOT-323
Number of Terminals
3
Transistor Element Material
SILICON
RoHS
Details
Factory Pack QuantityFactory Pack Quantity
3000
Unit Weight
0.000176 oz
Package
Bulk
Current-Collector (Ic) (Max)
100 mA
Base Product Number
DTC123
Mfr
Micro Commercial Co
Product Status
Active
Package Description
SMALL OUTLINE, R-PDSO-G3
Package Style
SMALL OUTLINE
Moisture Sensitivity Levels
1
Package Body Material
PLASTIC/EPOXY
Reflow Temperature-Max (s)
10
Rohs Code
Yes
Transition Frequency-Nom (fT)
250 MHz
Manufacturer Part Number
DTC123YUA-TP
Package Shape
RECTANGULAR
Number of Elements
1
Part Life Cycle Code
Active
Ihs Manufacturer
MICRO COMMERCIAL COMPONENTS CORP
Risk Rank
4.71
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Cut Tape
Series
-
JESD-609 Code
e3
Terminal Finish
Matte Tin (Sn)
Additional Feature
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
BUILT IN BIAS RESISTANCE RATIO IS 4.5
Terminal Position
DUAL
Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING
Peak Reflow Temperature (Cel)
260
Reach Compliance Code
compliant
JESD-30 Code
R-PDSO-G3
Configuration
SINGLE WITH BUILT-IN RESISTOR
Power - Max
200 mW
Transistor Application
SWITCHING
Polarity/Channel Type
NPN
Transistor Type
NPN - Pre-Biased
DC Current Gain (hFE) (Min) @ Ic, Vce
33 @ 10mA, 5V
Current - Collector Cutoff (Max)
-
Vce Saturation (Max) @ Ib, Ic
300mV @ 500µA, 10mA
Voltage - Collector Emitter Breakdown (Max)
50 V
Frequency - Transition
250 MHz
DC Current Gain-Min (hFE)
33
Resistor - Base (R1)
2.2 kOhms