Micro Commercial Co UMD18N-TP

Mounting Type

Surface Mount

Package / Case

6-TSSOP, SC-88, SOT-363

Supplier Device Package

SOT-363

Current-Collector (Ic) (Max)

100mA

Base Product Number

UMD18

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Power - Max

150mW

Transistor Type

1 NPN, 1 PNP - Pre-Biased

DC Current Gain (hFE) (Min) @ Ic, Vce

30 @ 10mA, 5V

Current - Collector Cutoff (Max)

500nA

Vce Saturation (Max) @ Ib, Ic

300mV @ 500μA, 10mA

Voltage - Collector Emitter Breakdown (Max)

50V

Frequency - Transition

200MHz

Resistor - Base (R1)

4.7kOhms