VSC8514XMK-11

Microchip Technology VSC8514XMK-11

Part No:

VSC8514XMK-11

Datasheet:

VSC8514-11

Package:

QFN

ROHS:

AINNX NO:

3297238-VSC8514XMK-11

Description:

4P QGMII CU 3E, COM, NO SYNCE, G

Products specifications
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 1 month ago)
  • Factory Lead Time
    7 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    QFN
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Supplier Device Package
    138-QFN (12x12)
  • Operating Temperature (Max.)
    125°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    138
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    NO LEAD
  • Number of Functions
    1
  • Supply Voltage
    1V
  • JESD-30 Code
    S-PBCC-N138
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    OTHER
  • Telecom IC Type
    ETHERNET TRANSCEIVER
  • Length
    12mm
  • Height Seated (Max)
    0.85mm
  • Width
    12mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
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