Microchip Technology SBR6030LE3

Mounting Type

Stud Mount

Package / Case

DO-203AB, DO-5, Stud

Supplier Device Package

DO-5

Mfr

Microchip Technology

Package

Bulk

Product Status

Active

Factory Pack QuantityFactory Pack Quantity

1

Manufacturer

Microchip

Brand

Microchip Technology

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Subcategory

Diodes & Rectifiers

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Diode Type

Schottky

Current - Reverse Leakage @ Vr

5 mA @ 30 V

Voltage - Forward (Vf) (Max) @ If

480 mV @ 60 A

Operating Temperature - Junction

-65°C ~ 150°C

Voltage - DC Reverse (Vr) (Max)

30 V

Current - Average Rectified (Io)

60A

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Zener Diodes

Capacitance @ Vr, F

-

Product Category

a particular group of related products.

Zener Diodes