Microchip Technology PIC18F26K80-I/SS

Factory Lead Time

9 Weeks

Mounting Type

Surface Mount

Package / Case

28-SSOP (0.209, 5.30mm Width)

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

28

Data Converters

A/D 8x12b

Number of I/Os

24

Watchdog Timers

Yes

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Series

PIC® XLP™ 18K

Published

2011

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

28

Terminal Finish

Matte Tin (Sn) - annealed

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

1W

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Supply Voltage

3.3V

Frequency

64MHz

Time@Peak Reflow Temperature-Max (s)

40

Base Part Number

PIC18F26K80

Pin Count

a count of all of the component leads (or pins)

28

Supply Voltage-Min (Vsup)

3V

Interface

CAN, I2C, LIN, SPI, UART, USART

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

64kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

RAM Size

3.6K x 8

Voltage - Supply (Vcc/Vdd)

1.8V~5.5V

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER

Core Processor

PIC

Peripherals

Brown-out Detect/Reset, LVD, POR, PWM, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

8-Bit

Program Memory Size

64KB 32K x 16

Connectivity

ECANbus, I2C, LINbus, SPI, UART/USART

Bit Size

8

Has ADC

YES

DMA Channels

NO

Data Bus Width

8b

EEPROM Size

1K x 8

CPU Family

PIC

Number of A/D Converters

1

Number of UART Channels

2

Number of ADC Channels

8

Number of PWM Channels

5

Height

1.8542mm

Length

10.4902mm

Width

5.588mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free