Microchip Technology PIC16F1508-I/SS

Factory Lead Time

6 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Mounting Type

Surface Mount

Package / Case

20-SSOP (0.209, 5.30mm Width)

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

20

Data Converters

A/D 12x10b; D/A 1x5b

Number of I/Os

17

Watchdog Timers

Yes

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Series

PIC® XLP™ 16F

Published

2005

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

20

ECCN Code

EAR99

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

800mW

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Supply Voltage

5V

Terminal Pitch

The center distance from one pole to the next.

0.65mm

Frequency

20MHz

Time@Peak Reflow Temperature-Max (s)

40

Base Part Number

PIC16F1508

Pin Count

a count of all of the component leads (or pins)

20

Supply Voltage-Max (Vsup)

5.5V

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

2.5/5V

Supply Voltage-Min (Vsup)

2.5V

Interface

I2C, LIN, SPI, UART, USART

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

7kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

2.3V~5.5V

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Core Processor

PIC

Peripherals

Brown-out Detect/Reset, POR, PWM, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

8-Bit

Program Memory Size

7KB 4K x 14

Connectivity

I2C, LINbus, SPI, UART/USART

Bit Size

8

Has ADC

YES

DMA Channels

NO

Data Bus Width

8b

Number of Timers/Counters

3

CPU Family

PIC

Number of Programmable I/O

18

Number of ADC Channels

12

Number of PWM Channels

4

Number of I2C Channels

1

Height

1.85mm

Length

7.5mm

Width

5.6mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free