Microchip Technology MSCSM120SKM11CT3AG

Mounting Type

Chassis Mount

Package / Case

Module

Mfr

Microchip Technology

Package

Tube

Product Status

Active

Base Product Number

MSCSM120

Vr - Reverse Voltage

1200 V

Vds - Drain-Source Breakdown Voltage

1200 V

Typical Turn-On Delay Time

30 ns

Vgs th - Gate-Source Threshold Voltage

1.8 V

Pd - Power Dissipation

1067 W

Transistor Polarity

N-Channel

Maximum Operating Temperature

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

+ 125 C

Vgs - Gate-Source Voltage

- 10 V, 25 V

Minimum Operating Temperature

- 40 C

Factory Pack QuantityFactory Pack Quantity

1

Mounting Styles

Screw Mount

Manufacturer

Microchip

Brand

Microchip Technology

Rds On - Drain-Source Resistance

10.4 mOhms

RoHS

Details

Typical Turn-Off Delay Time

50 ns

Id - Continuous Drain Current

254 A

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Type

MOSFET

Subcategory

Discrete Semiconductor Modules

Technology

SiC

Voltage - Isolation

4000Vrms

Configuration

1 Phase

Voltage

1.2 kV

Current

254 A

Rise Time

In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

30 ns

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Discrete Semiconductor Modules

Product

Power MOSFET Modules

Vf - Forward Voltage

1.5 V at 180 A

Product Category

a particular group of related products.

Discrete Semiconductor Modules