DM183026

Microchip Technology DM183026

Part No:

DM183026

Package:

-

ROHS:

AINNX NO:

6176542-DM183026

Description:

KIT EVALUATION PIC16F/PIC24F

Products specifications
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Box
  • Series
    mTouch™
  • Published
    2009
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Data Bus Width
    8b
  • Utilized IC / Part
    PIC16F727, PIC24FJ128GB106
  • Supplied Contents
    Board(s), Cable(s)
  • Evaluation Kit
    Yes
  • Sensor Type
    Touch, Capacitive
  • Core Architecture
    PIC
  • Embedded
    Yes, Other
  • REACH SVHC
    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
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