DM160226

Microchip Technology DM160226

Part No:

DM160226

Package:

Module

ROHS:

AINNX NO:

6179214-DM160226

Description:

MGC3030 - Woodstar Development Kit

Products specifications
  • Factory Lead Time
    14 Weeks
  • Package / Case
    Module
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Box
  • Series
    GestIC®
  • Published
    2001
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Voltage - Supply
    3.135V~3.465V
  • Interface
    I2C
  • Utilized IC / Part
    MGC3030
  • Supplied Contents
    Board(s)
  • Evaluation Kit
    Yes
  • Sensor Type
    Touch, Capacitive
  • REACH SVHC
    No SVHC
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
0 Similar Products Remaining
Documents & Media Download datasheets and manufacturer documentation for Microchip Technology DM160226.