A3P600-FGG256I

Microchip Technology A3P600-FGG256I

Part No:

A3P600-FGG256I

Datasheet:

-

Package:

FBGA-256

AINNX NO:

31174900-A3P600-FGG256I

Description:

FPGA - Field Programmable Gate Array A3P600-FGG256I LEAD FREE

Products specifications
  • Lifecycle Status
    Production (Last Updated: 1 month ago)
  • Package / Case
    FBGA-256
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    256
  • Supplier Device Package
    256-FPBGA (17x17)
  • Number of Terminals
    256
  • Shipping Restrictions
    This product may require additional documentation to export from the United States.
  • RoHS
    Details
  • Number of Logic Elements
    6500 LE
  • Number of I/Os
    177 I/O
  • Supply Voltage-Min
    1.425 V
  • Minimum Operating Temperature
    - 40 C
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 85 C
  • Mounting Styles
    SMD/SMT
  • Maximum Operating Frequency
    231 MHz
  • Moisture Sensitive
    Yes
  • Number of Logic Array Blocks - LABs
    -
  • Factory Pack QuantityFactory Pack Quantity
    90
  • Total Memory
    110592 bit
  • Tradename
    ProASIC3
  • Typical Operating Supply Voltage
    1.5000 V
  • Supply Voltage-Max
    1.575 V
  • Package
    Tray
  • Base Product Number
    A3P600
  • Mfr
    Microchip Technology
  • Product Status
    Active
  • Package Description
    BGA,
  • Package Style
    GRID ARRAY
  • Moisture Sensitivity Levels
    3
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Min
    -40 °C
  • Supply Voltage-Nom
    1.5 V
  • Reflow Temperature-Max (s)
    40
  • Operating Temperature-Max
    100 °C
  • Rohs Code
    Yes
  • Manufacturer Part Number
    A3P600-FGG256I
  • Clock Frequency-Max
    350 MHz
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    MICROSEMI CORP
  • Risk Rank
    1.31
  • Series
    A3P600
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40 to 85 °C
  • JESD-609 Code
    e1
  • ECCN Code
    3A001.A.7.A
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85 °C
  • Min Operating Temperature
    -40 °C
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Technology
    CMOS
  • Voltage - Supply
    1.425V ~ 1.575V
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Terminal Pitch

    The center distance from one pole to the next.

    1 mm
  • Reach Compliance Code
    compliant
  • Frequency
    231 MHz
  • JESD-30 Code
    S-PBGA-B256
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.5 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    1.575 V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    1.425 V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    13.5 kB
  • Operating Supply Current
    45 mA
  • RAM Size
    13.5 kB
  • Organization
    13824 CLBS, 600000 GATES
  • Seated Height-Max
    1.8 mm
  • Programmable Logic Type

    Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    6500
  • Total RAM Bits
    110592
  • Number of Gates

    The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

    600000
  • Max Frequency
    231 MHz
  • Speed Grade
    STD
  • Number of Registers
    13824
  • Number of CLBs
    13824
  • Number of Equivalent Gates
    600000
  • Height
    1.2 mm
  • Length
    17 mm
  • Width
    17 mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • Lead Free
    Lead Free
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