Microchip WEDPN16M64V-133B2I

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

219

Number of Words

16777216 words

Number of Words Code

16000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

SQUARE

Package Style

GRID ARRAY

Supply Voltage-Nom (Vsup)

3.3 V

Reflow Temperature-Max (s)

NOT SPECIFIED

Manufacturer Part Number

WEDPN16M64V-133B2I

Rohs Code

No

Part Life Cycle Code

Transferred

Ihs Manufacturer

WHITE ELECTRONIC DESIGNS CORP

Package Description

BGA,

Risk Rank

5.66

Access Time-Max

5.5 ns

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

AUTO/SELF REFRESH

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

1.27 mm

Reach Compliance Code

unknown

JESD-30 Code

S-PBGA-B219

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Supply Voltage-Max (Vsup)

3.6 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Supply Voltage-Min (Vsup)

3 V

Number of Ports

A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

1

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

SYNCHRONOUS

Organization

16MX64

Memory Width

64

Memory Density

1073741824 bit

Memory IC Type

SYNCHRONOUS DRAM

Access Mode

Distinct operation recognized by the protection mechanisms as a possible operation on an object.

MULTI BANK PAGE BURST

Self Refresh

YES