MS2214

Microchip MS2214

Part No:

MS2214

Manufacturer:

Microchip

Datasheet:

-

Package:

-

AINNX NO:

46075199-MS2214

Description:

Trans RF BJT NPN 8A 4-Pin Case M218

Products specifications
  • Lifecycle Status
    Production (Last Updated: 2 months ago)
  • Mount
    Chassis Mount, Screw
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    4
  • Number of Terminals
    2
  • Transistor Element Material
    SILICON
  • Package
    Bulk
  • Mfr
    KEMET
  • Product Status
    Obsolete
  • Collector-Emitter Breakdown Voltage
    55 V
  • RoHS
    Compliant
  • Package Description
    M218, 2 PIN
  • Package Style
    FLANGE MOUNT
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Operating Temperature-Max
    250 °C
  • Rohs Code
    No
  • Manufacturer Part Number
    MS2214
  • Package Shape
    RECTANGULAR
  • Manufacturer
    Microsemi Corporation
  • Number of Elements
    1
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    MICROSEMI CORP
  • Risk Rank
    5.11
  • Series
    -
  • JESD-609 Code
    e0
  • Pbfree Code
    No
  • ECCN Code
    EAR99
  • Terminal Finish
    TIN LEAD
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    250 °C
  • Min Operating Temperature
    -65 °C
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    HIGH RELIABILITY
  • Subcategory
    Other Transistors
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    300 W
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    FLAT
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Reach Compliance Code
    unknown
  • Pin Count

    a count of all of the component leads (or pins)

    2
  • JESD-30 Code
    R-CDFM-F2
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Polarity
    NPN
  • Configuration
    SINGLE
  • Case Connection
    BASE
  • Output Power

    That power available at a specified output of a device under specified conditions of operation.

    85 W
  • Transistor Application
    AMPLIFIER
  • Polarity/Channel Type
    NPN
  • Max Collector Current
    8 A
  • Gain
    7.5 dB
  • Transition Frequency
    960 MHz
  • Collector Base Voltage (VCBO)
    55 V
  • Power Dissipation-Max (Abs)
    300 W
  • Collector Current-Max (IC)
    8 A
  • DC Current Gain-Min (hFE)
    20
  • Highest Frequency Band
    L BAND
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • Lead Free
    Lead Free
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