Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES
Number of Terminals
8
Package Description
MSOP-8
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Moisture Sensitivity Levels
1
Package Body Material
PLASTIC/EPOXY
Operating Temperature-Min
-40 °C
Reflow Temperature-Max (s)
30
Slew Rate-Nom
0.6 V/us
Operating Temperature-Max
85 °C
Manufacturer Part Number
MIC7122BMM
Supply Voltage-Nom (Vsup)
5 V
Package Code
TSSOP
Package Shape
SQUARE
Manufacturer
Rochester Electronics LLC
Part Life Cycle Code
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
Common-mode Reject Ratio-Nom
75 dB
Risk Rank
5.37
Part Package Code
MSOP
JESD-609 Code
e0
Pbfree Code
No
Terminal Finish
TIN LEAD
Subcategory
Operational Amplifier
Technology
CMOS
Terminal Position
DUAL
Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING
Peak Reflow Temperature (Cel)
240
Number of Functions
2
Terminal Pitch
The center distance from one pole to the next.
0.65 mm
Reach Compliance Code
unknown
Pin Count
a count of all of the component leads (or pins)
8
JESD-30 Code
S-PDSO-G8
Qualification Status
An indicator of formal certification of qualifications.
COMMERCIAL
Temperature Grade
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
INDUSTRIAL
Amplifier Type
OPERATIONAL AMPLIFIER
Seated Height-Max
1.09 mm
Unity Gain BW-Nom
465 kHz
Average Bias Current-Max (IIB)
0.0005 µA
Supply Voltage Limit-Max
16.5 V
Input Offset Voltage-Max
9000 µV
Width
3 mm
Length
3 mm