Micrel DSPIC33EP256GM710-H/PF

Mounting Type

Through Hole

Package / Case

20-DIP (0.300, 7.62mm)

Supplier Device Package

20-DIP

Number of I/Os

18

Package

Tube

Base Product Number

P89LPC920

Mfr

NXP USA Inc.

Data Converters

-

Product Status

Obsolete

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 85°C (TA)

Series

LPC900

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Base Part Number

DSPIC33EP256GM710

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

Speed

18MHz

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

2.4V ~ 3.6V

Core Processor

8051

Peripherals

Brown-out Detect/Reset, LED, POR, PWM, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

8-Bit

Program Memory Size

2KB (2K x 8)

Connectivity

I²C, UART/USART

EEPROM Size

-