Mersen X213644

Mounting Type

Through Hole

Package / Case

8-DIP (0.300, 7.62mm), 4 Leads

Supplier Device Package

8-DIP Modified

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

SP001543314

Series

PVA, HEXFET®

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination Style

PC Pin

Output Type

AC, DC

Circuit

SPST-NO (1 Form A)

Voltage - Load

0V ~ 200V

On-State Resistance (Max)

24 Ohms

Load Current

The Load Current can be defined as 1) Full load current the maximum current that an electrical machine can operate; 2) Rated Current the current rated on the nameplate of an electrical machine; 3) Nominal Current is generally mentioned in the specification documents that is normally the same value as the rated one.

150mA