KL5BPLC250WMP

MegaChips Corporation KL5BPLC250WMP

Part No:

KL5BPLC250WMP

Datasheet:

-

Package:

144-TQFP Exposed Pad

ROHS:

AINNX NO:

4360269-KL5BPLC250WMP

Description:

IC MULTI-HOP POWERLINE TQFP-144

Products specifications
  • Factory Lead Time
    18 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    144-TQFP Exposed Pad
  • Supplier Device Package
    144-TQFP (16x16)
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Applications
    Broadband Power Line Communications
  • Voltage - Supply
    1.2V 3.3V
  • Interface
    AC/DC, Coax, Ethernet, GPIO, MII, RMII, RS485, Twisted Pair, UART
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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