XR4151CP-F
8-DIP (0.300, 7.62mm)
4972827-XR4151CP-F
IC V/F CONV 10KHZ 8DIP
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
In electronics and signal processing, full scale represents the maximum amplitude a system can represent.