Maxim DS3101GN

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

256

Package Description

17 X 17 MM, 1 MM PITCH, CSBGA-256

Package Style

GRID ARRAY, LOW PROFILE

Moisture Sensitivity Levels

NOT APPLICABLE

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.8 V

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

85 °C

Rohs Code

No

Manufacturer Part Number

DS3101GN

Package Code

LBGA

Package Shape

SQUARE

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

Active

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.91

Part Package Code

BGA

JESD-609 Code

e0

Pbfree Code

No

Terminal Finish

TIN LEAD

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

245

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

1 mm

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

256

JESD-30 Code

S-PBGA-B256

Qualification Status

An indicator of formal certification of qualifications.

COMMERCIAL

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Seated Height-Max

1.26 mm

Telecom IC Type

SUPPORT CIRCUIT

Width

17 mm

Length

17 mm