MS263-20C
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28165970-MS263-20C
RF SHLD COVER 0.803"X1.059" SNAP
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
a group of products which fulfill a similar need for a market segment or market as a whole.
a particular group of related products.