MS257-10C
-
28167735-MS257-10C
RF SHLD COVER 1.035"X1.035" SNAP
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
a group of products which fulfill a similar need for a market segment or market as a whole.
a particular group of related products.