Contact plating
gold-plated
Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
NO
Number of pins
28
Number of Terminals
3
Transistor Element Material
SILICON
Exterior Housing Material
1
Type of connector
pin strips
Connector
socket
Kind of connector
female
Spatial orientation
straight
Contacts pitch
2.54mm
Electrical mounting
THT
Connector pinout layout
1x28
Gross weight
2.1 g
Part Life Cycle Code
Active
Ihs Manufacturer
MAGNACHIP SEMICONDUCTOR LTD
Package Description
,
Drain Current-Max (ID)
10.6 A
Operating Temperature-Max
150 °C
Package Body Material
PLASTIC/EPOXY
Package Shape
RECTANGULAR
Package Style
FLANGE MOUNT
Operating temperature
-40...163°C
ECCN Code
EAR99
Terminal Position
SINGLE
Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
THROUGH-HOLE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
unknown
Current rating
1.5A
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PSFM-T3
Configuration
SINGLE WITH BUILT-IN DIODE
Operating Mode
A phase of operation during the operation and maintenance stages of the life cycle of a facility.
ENHANCEMENT MODE
Case Connection
ISOLATED
Transistor Application
SWITCHING
Polarity/Channel Type
N-CHANNEL
JEDEC-95 Code
TO-220AB
Drain-source On Resistance-Max
0.38 Ω
Pulsed Drain Current-Max (IDM)
31.8 A
DS Breakdown Voltage-Min
650 V
Avalanche Energy Rating (Eas)
215 mJ
FET Technology
METAL-OXIDE SEMICONDUCTOR
Power Dissipation-Max (Abs)
30.5 W
Rated voltage
60V
Feedback Cap-Max (Crss)
38.7 pF
Profile
beryllium copper
Plating thickness
0.75µm
Flammability rating
UL94V-0