M/A-Com Technology Solutions MRF321

Factory Lead Time

14 Weeks

Mount

Chassis Mount

Mounting Type

Chassis Mount

Package / Case

244-04

Number of Pins

4

Transistor Element Material

SILICON

Collector-Emitter Breakdown Voltage

33V

Number of Elements

1

Operating Temperature (Max.)

200°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Published

2009

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

HIGH RELIABILITY

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

10W

Terminal Position

RADIAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

FLAT

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

a count of all of the component leads (or pins)

4

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE

Power - Max

10W

Transistor Application

AMPLIFIER

Polarity/Channel Type

NPN

Transistor Type

NPN

Collector Emitter Voltage (VCEO)

33V

Max Collector Current

1.1A

DC Current Gain (hFE) (Min) @ Ic, Vce

20 @ 500mA 5V

Gain

13dB

Collector Base Voltage (VCBO)

60V

Highest Frequency Band

ULTRA HIGH FREQUENCY B

Collector-Base Capacitance-Max

12pF

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant