M/A-Com Technology Solutions M09001G-12

Factory Lead Time

25 Weeks

Mounting Type

Surface Mount

Package / Case

Die

Supplier Device Package

Die

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2016

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Applications

Display (LED Drivers), Handheld/Mobile Devices, Power Supply