MACOM Technology Solutions FDZ5013

Package / Case

Module

Supplier Device Package

-

Number of Terminals

3

Mfr

MACOM Technology Solutions

Package

Tray

Product Status

Active

Factory Pack QuantityFactory Pack Quantity

10

Manufacturer

MACOM

Brand

MACOM

RoHS

N

Package Description

MODULE,3LEAD,.8

Package Body Material

METAL

Package Equivalence Code

MODULE,3LEAD,.8

Operating Temperature-Min

-54 °C

Operating Temperature-Max

100 °C

Operating Frequency (Max)

12000 MHz

Manufacturer Part Number

FDZ5013

Part Life Cycle Code

Active

Ihs Manufacturer

M/A-COM TECHNOLOGY SOLUTIONS INC

Risk Rank

5.22

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

I/P POWER-MAX (PEAK)=23DBM

Subcategory

Filters

Construction

COMPONENT

Reach Compliance Code

compliant

Frequency

6GHz ~ 24GHz

Function

Frequency Doubler

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Signal Conditioning

RF/Microwave Device Type

FREQUENCY DOUBLER

Operating Frequency-Min

3000 MHz

VSWR-Max

2

RF Type

The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

General Purpose

Characteristic Impedance

50 Ω

Secondary Attributes

-

Product

Frequency Doublers

Conversion Loss-Max

15 dB

Product Category

a particular group of related products.

Signal Conditioning