MACOM Technology Solutions FDC2310

Package / Case

Module

Supplier Device Package

-

Mfr

MACOM Technology Solutions

Package

Tray

Product Status

Active

Factory Pack QuantityFactory Pack Quantity

10

Manufacturer

MACOM

Brand

MACOM

RoHS

N

Operating Temperature-Min

-54 °C

Operating Temperature-Max

100 °C

Rohs Code

No

Operating Frequency (Max)

8000 MHz

Manufacturer Part Number

FDC2310

Part Life Cycle Code

Active

Ihs Manufacturer

M/A-COM TECHNOLOGY SOLUTIONS INC

Risk Rank

5.26

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

I/P POWER-MAX (PEAK)=23DBM

Subcategory

Filters

Construction

MODULE

Reach Compliance Code

compliant

Frequency

3GHz ~ 16GHz

Function

Driver

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Signal Conditioning

RF/Microwave Device Type

FREQUENCY DOUBLER

Operating Frequency-Min

1500 MHz

VSWR-Max

2

RF Type

The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

General Purpose

Input Power-Max (CW)

10 dBm

Characteristic Impedance

50 Ω

Secondary Attributes

-

Product

Frequency Doublers

Conversion Loss-Max

14.5 dB

Product Category

a particular group of related products.

Signal Conditioning