MACOM MADR-009190-000DIE

Mount

Surface Mount

Package Type

PQFN EP

Rad Hardened

No

Mounting

Surface Mount

Factory Pack QuantityFactory Pack Quantity

100

Manufacturer

MACOM

Brand

MACOM

RoHS

Details

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Waffle

Subcategory

PMIC - Power Management ICs

Technology

CMOS

Pin Count

a count of all of the component leads (or pins)

20

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Gate Drivers

Product Category

a particular group of related products.

Gate Drivers

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No