Luminus Devices Inc. CXM-22-35-80-36-AC10-F3-3

Factory Lead Time

6 Weeks

Mount

Surface Mount

Number of Pins

2

CCT(K)

3500K 3-Step MacAdam Ellipse

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

CXM-22 Gen 2

Published

2016

Size / Dimension

28.00mm Lx28.00mm W

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Chip On Board (COB)

Color

White, Warm

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

90W

Reach Compliance Code

unknown

Configuration

Square

Max Current Rating

2.56A

Voltage - Forward (Vf) (Typ)

34V

Viewing Angle

the angle at which a display can be viewed with acceptable visual performance.

120°

Current - Test

1.28A

Lumens/Watt @ Current - Test

141 lm/W

CRI (Color Rendering Index)

80

Lens Type

Lenses are classified by the curvature of the two optical surfaces. A lens is biconvex (or double convex, or just convex) if both surfaces are convex. If both surfaces have the same radius of curvature, the lens is equiconvex. A lens with two concave surfaces is biconcave (or just concave).

Flat

Luminous Flux

the measure of the perceived power of light.

6.755 klm

Light Emitting Surface (LES)

22.00mm Dia

Number of LEDs

1

Height

1.37mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant