Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
NO
Material
fiberglass rod in plastic casing, red color
Exterior Housing Material
4
Permissible load
static tensile forces - not more than 2 kN; compressive forces - not more than 0.5 kN/cm
Operating conditions
minimum bending radius - 30 mm
Purpose
for pulling cables in cable channels, conduits, pipes, etc.
Transport packaging size/quantity
39*38*37/20
Gross weight
805.00
Operating Temperature-Max
150 °C
Forward Voltage-Max (VF)
1.05 V
Ihs Manufacturer
LESHAN RADIO CO LTD
Part Life Cycle Code
Active
Rohs Code
Yes
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
coil
JESD-609 Code
e3
ECCN Code
EAR99
Terminal Finish
TIN
Composition
Glass rod
Color
Red
Peak Reflow Temperature (Cel)
260
Reach Compliance Code
unknown
Time@Peak Reflow Temperature-Max (s)
10
Configuration
BRIDGE, 4 ELEMENTS
Diode Type
BRIDGE RECTIFIER DIODE
Case Connection
ISOLATED
Output Current-Max
35 A
Tool type
Device for preparing cable channels (mini Narrow)
Number of Phases
1
Operating temperature range
-20…+50 °C
Rep Pk Reverse Voltage-Max
800 V
Non-rep Pk Forward Current-Max
400 A
Breakdown Voltage-Min
800 V
Length
50 m
Diameter
3.5 mm