Littelfuse DPG30C300PB

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8541.10.00.80

Automotive

No

PPAP

No

Peak Reverse Repetitive Voltage (V)

300

Maximum Continuous Forward Current (A)

30

Peak Non-Repetitive Surge Current (A)

240

Peak Forward Voltage (V)

1.51@30A

Peak Reverse Current (uA)

1

Maximum Power Dissipation (mW)

90000

Peak Reverse Recovery Time (ns)

35(Typ)

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

175

Mounting

Through Hole

Package Height

9.15(Max)

Package Width

4.82(Max)

Package Length

10.66(Max)

PCB changed

3

Tab

Tab

Standard Package Name

TO-220

Supplier Package

TO-220AB

Lead Shape

Through Hole

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Type

Switching Diode

Pin Count

a count of all of the component leads (or pins)

3

Configuration

Dual Common Cathode