Linx Technologies Inc. ANT-868-CHP-T

Factory Lead Time

9 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

Ceramic

Operating Temperature (Max.)

85°C

Operating Temperature (Min.)

-40°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

CHP

Published

2012

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

Applications

ISM, LoRa, Sensor Networks, SigFox

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

HIGH RELIABILITY

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

3W

Construction

COMPONENT

Frequency

868MHz

Polarization

LINEAR

Impedance

In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.

50Ohm

Gain

0.5dBi

Frequency Range

A continuous range or spectrum of frequencies that extends from one limiting frequency to another.

863MHz~873MHz

RF/Microwave Device Type

ANTENNA-OTHER

RF Family/Standard

General ISM

Antenna Type

There are several different types of antennas in three broad categories: omni-directional, directional, and semi-directional.

Chip

VSWR

2

Number of Bands

1

Frequency Group

UHF 300MHz~1GHz

Omnidirectional

YES

Height

1.7018mm

Length

16.002mm

Width

3.048mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Lead Free