Linear Technology/Analog Devices LTC1177CN-12

Mounting Type

Through Hole

Package / Case

18-DIP (0.300, 7.62mm)

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Driver Configuration

High-Side

Operating Temperature (Max.)

70°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Published

2012

JESD-609 Code

e0

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

18

ECCN Code

EAR99

Terminal Finish

Tin/Lead (Sn/Pb)

Voltage - Supply

11.4V~12.6V

Terminal Position

DUAL

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

1

Supply Voltage

12V

Terminal Pitch

The center distance from one pole to the next.

2.54mm

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Base Part Number

LTC1177-12

Pin Count

a count of all of the component leads (or pins)

18

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

COMMERCIAL

Supply Current-Max

3mA

Input Type

Non-Inverting

Output Polarity

TRUE

Input Characteristics

STANDARD

Interface IC Type

BUFFER OR INVERTER BASED MOSFET DRIVER

Number of Drivers

1

Turn On Time

The time that it takes a gate circuit to allow a current to reach its full value.

2500 µs

Output Peak Current Limit-Nom

0.62A

High Side Driver

YES

Width

7.62mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant