L-Com U3A00056-05M

Lead Free Status / RoHS Status

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CCT(K)

2700K 2-Step MacAdam Ellipse

Series

Gen 7 Vero® 18 Array

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Size / Dimension

36.20mm Diameter

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

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Type

Chip On Board (COB)

Color

White, Warm

Configuration

Round

Voltage - Forward (Vf) (Typ)

34.1V

Viewing Angle

the angle at which a display can be viewed with acceptable visual performance.

120°

Current - Test

1.17A

Lumens/Watt @ Current - Test

136 lm/W

CRI (Color Rendering Index)

80

Current - Max

2.34A

Lens Type

Lenses are classified by the curvature of the two optical surfaces. A lens is biconvex (or double convex, or just convex) if both surfaces are convex. If both surfaces have the same radius of curvature, the lens is equiconvex. A lens with two concave surfaces is biconcave (or just concave).

Flat

Flux @ Current/Temperature - Test

5434 lm (Typ)

Light Emitting Surface (LES)

18.40mm Diameter

Wavelength

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Features

With Connector

Height

1.90mm