L-Com MPMM8OM4AZ-5

Housing Material

Aluminium

RoHS

Compliant

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

5 %

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

440 ppm/°C

Resistance

560 Ω

Composition

Wirewound

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

80 W

Lead/Base Style

Wire Leads

Width

40.005 mm

Height

19.9898 mm

Length

140.0048 mm