LAPIS DTC114ECAHZGT116

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Brass, Tin

Mount

Through Hole

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Supplier Device Package

SST3

Housing Material

Nylon

RoHS

Compliant

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Current-Collector (Ic) (Max)

100mA

Other Names

DTC114ECAHZGT116DKR

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

Automotive, AEC-Q101

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Screw

Color

Blue

Number of Rows

1

Pitch

5.0038 mm

Orientation

Right Angle

Number of Contacts

7

Housing Color

Blue

Voltage

300 V

Number of Circuits

7

Plating

Brass

Number of Levels

1

Current

17.5 A

Wire Gauge (Max)

30 AWG

Wire Gauge (Min)

12 AWG

Power - Max

350mW

Transistor Type

NPN - Pre-Biased + Diode

DC Current Gain (hFE) (Min) @ Ic, Vce

30 @ 10mA, 5V

Current - Collector Cutoff (Max)

-

Vce Saturation (Max) @ Ib, Ic

300mV @ 500µA, 10mA

Number of Positions Per Level

7

Frequency - Transition

250MHz

Resistor - Base (R1)

10 kOhms

Resistor - Emitter Base (R2)

10 kOhms

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No