LAPIS DTB113ESTP

Mounting Type

Through Hole

Package / Case

SC-72 Formed Leads

Supplier Device Package

SPT

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Current-Collector (Ic) (Max)

500mA

Other Names

DTB113ESTP-ND DTB113ESTPTB

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Box (TB)

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Base Part Number

DTB113

Power - Max

300mW

Transistor Type

PNP - Pre-Biased

DC Current Gain (hFE) (Min) @ Ic, Vce

33 @ 50mA, 5V

Current - Collector Cutoff (Max)

500nA

Vce Saturation (Max) @ Ib, Ic

300mV @ 2.5mA, 50mA

Voltage - Collector Emitter Breakdown (Max)

50V

Frequency - Transition

200MHz

Resistor - Base (R1)

1 kOhms

Resistor - Emitter Base (R2)

1 kOhms