LAPIS BU1852GUW-E2

Mounting Type

Surface Mount

Package / Case

35-VFBGA

Supplier Device Package

35-VBGA (4x4)

Package

Bulk

Base Product Number

085651

Mfr

Molex

Product Status

Active

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

BU1852GUWE2

Series

*

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Applications

-

Voltage - Supply

1.65 V ~ 3.6 V

Base Part Number

BU1852

Interface

-