LAPIS BAT54AHMFHT116

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Supplier Device Package

SSD3

Material

Brass

RoHS

Compliant

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

BAT54AHMFHT116TR

Current - Average Rectified (Io) (per Diode)

200mA (DC)

Series

Automotive, AEC-Q101

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Gender

Female

ELV

Compliant

Speed

Small Signal =< 200mA (Io), Any Speed

Diode Type

Schottky

Current - Reverse Leakage @ Vr

2µA @ 25V

Voltage - Forward (Vf) (Max) @ If

800mV @ 100mA

Operating Temperature - Junction

150°C (Max)

Voltage - DC Reverse (Vr) (Max)

30V

Diode Configuration

1 Pair Common Anode

Reverse Recovery Time (trr)

50ns

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

Lead Free

Not Applicable