Lantronix, Inc. XPC240100S-02

Factory Lead Time

4 Weeks

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

xPico® 240

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Applications

General Purpose

Frequency

2.4GHz 5GHz

Function

Gateway

Interface

Ethernet, UART, USB

Data Rate (Max)

150Mbps

Modulation or Protocol

Modulation is the process of converting data into radio waves by adding information to an electronic or optical carrier signal. A carrier signal is one with a steady waveform -- constant height, or amplitude, and frequency.

802.11 a/b/g/n