XPC100A003-01-B

Lantronix XPC100A003-01-B

Part No:

XPC100A003-01-B

Manufacturer:

Lantronix

Datasheet:

-

Package:

-

AINNX NO:

62737744-XPC100A003-01-B

Category:

Accessories

Description:

XPICO THERMAL PAD L2.5MM 50-PC B

Products specifications
  • Package
    Bulk
  • Mfr
    Lantronix, Inc.
  • Product Status
    Active
  • Factory Pack QuantityFactory Pack Quantity
    1
  • Manufacturer
    Lantronix
  • Brand
    Lantronix
  • RoHS
    Details
  • Series
    -
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Subcategory
    Thermal Management
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Thermal Interface Products
  • Product
    Thermally Conductive Gap Pad
  • Product Category

    a particular group of related products.

    Thermal Interface Products
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