Laird Thermal Materials A16006-18

Material

Silicone

Shape

Square

Factory Pack QuantityFactory Pack Quantity

1

RoHS

Details

Package

Bulk

Mfr

Laird Technologies - Thermal Materials

Product Status

Active

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

Tflex™ 700

Type

Gap Filler Pad, Sheet

Color

Gray

Usage

-

Shelf Life

24 Months

Adhesive

Tacky - Both Sides

Storage/Refrigeration Temperature

-

Shelf Life Start

Date of Shipment

Backing, Carrier

-

Outline

457.20mm x 457.20mm

Thermal Conductivity

a measure of a material's ability to?conduct heat.?

5.0W/m-K

Thermal Resistivity

Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance.

-

Width

18 in

Length

18 in

Thickness

0.180 (4.57mm)