Laird 97055115

Mounting Type

Through Hole

Housing Material

Polyamide (PA46), Nylon 4/6, Glass Filled

Number of Positions or Pins (Grid)

14 (2 x 7)

Contact Material - Mating

Phosphor Bronze

Contact Material - Post

Phosphor Bronze

Contact Finish Mating

Tin

Mounting Styles

Adhesive PSA

Series

8

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Termination

Solder

Type

DIP, 0.3 (7.62mm) Row Spacing

Pitch - Mating

0.100 (2.54mm)

Contact Finish - Post

Tin

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

EMI Gaskets, Sheets & Absorbers

Pitch - Post

0.100 (2.54mm)

Product

Fingerstock

Features

Closed Frame, Elevated

Width

4.06 mm

Length

609.6 mm

Thickness

0.76 mm

Contact Finish Thickness - Mating

200.0µin (5.08µm)

Contact Finish Thickness - Post

200.0µin (5.08µm)